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切割用途 |
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Cutting purpose |
主要用(yong)于手(shou)機(ji)鋼化膜、手(shou)機(ji)蓋板(ban)、TFT、觸摸屏、行車記(ji)錄儀、光學玻(bo)璃、電子玻(bo)璃等玻(bo)璃產(chan)品直線(xian)和曲線(xian)切割(ge)。
mainly used in the steel film, mobile phone cover, TFT, touch screen, driving recorder, optical glass, electronic glass and other glass products straight line and curve cutting.
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機器特(te)點 |
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The machine features |
l大理石工作臺(tai)面(mian),不變形,臺(tai)面(mian)平整(zheng)度高,臺(tai)面(mian)平整(zheng)度小于20um
lMarble work table, not deformed, the mesa flatness is high, mesa flatness is less than 20um
l大理石橫梁,進(jin)口(kou)伺(si)服控制,定位精(jing)度(du)高
l Marble beams, imported servo control, high positioning accuracy
l 自動(dong)邊料切(qie)割,不浪費料
lAutomatic edge cutting, not waste material
l可任設原點位,原點補正(zheng)功(gong)能,切割(ge)中暫停功(gong)能
lCan be set at the origin, the origin complement function, the cutting function
l真(zhen)空吸(xi)附玻璃,自動吸(xi)氣/吹氣功能
lVacuum adsorption glass, automatically aspirating/blowing energy
l可(ke)選(xuan)擇CCD對位影(ying)像裝置,高精度(du)切(qie)割
lCan choose CCD image device, high - precision cutting